DocumentCode
1692558
Title
New effective dielectric constant model for ultra-high speed microstrip lines on multilayer dielectric substrates: effect of conductor-dielectric interphase
Author
Vo, Hung T. ; Davidson, Craig ; Shi, Frank G.
Author_Institution
0ptoElectronics Packaging & Autom. Lab., California Univ., Irvine, CA, USA
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
86
Lastpage
89
Abstract
The existing CAD formulae are complicated and inaccurate at high frequencies. In particular, no closed-form expression has been obtained for the effective dielectric constant of microstrip lines on multi-layed dielectric substrate by considering the line-substrate interphase effect, although attempts have been made to study the finite thickness effect of the conductor and dielectric substrate. The present work represents the first attempt to obtain a closed-form CAD formula for the effective dielectric constant of microstrip lines on dielectric substrates by considering the effect of conductor-substrate interphase, in addition to the skin effect losses, dielectric loss, dispersion and radiation losses based on the quasi-TEM assumption and the superposition of partial capacitance. The model is verified by experimental observations on the effective dielectric constant and its dependence on microstrip dimension and frequency.
Keywords
circuit CAD; dielectric losses; high-speed integrated circuits; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; microstrip lines; permittivity; skin effect; substrates; closed-form CAD formula; conductor-dielectric interphase; dielectric loss; dispersion; effective dielectric constant model; line-substrate interphase effect; multi-layed dielectric substrate; partial capacitance; quasi-TEM assumption; radiation losses; skin effect losses; ultra-high speed microstrip lines; Closed-form solution; Conductors; Dielectric constant; Dielectric losses; Dielectric substrates; Dispersion; Frequency; Microstrip components; Nonhomogeneous media; Skin effect;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008077
Filename
1008077
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