DocumentCode
1692596
Title
High Vgs MOSFET characteristics with thin gate oxide for PMIC application
Author
Cha, Jaehan ; Lee, Kyungho ; Kim, Sungoo ; Kim, Juho ; Park, Namkyu ; Lee, Taejong
Author_Institution
CE & SMS Div., MagnaChip Semicond. Corp., Cheongju, South Korea
fYear
2011
Firstpage
211
Lastpage
214
Abstract
We present the characteristics of a newly developed MOSFET which has thin gate oxide but sustains high gate voltage. It consists of MIM capacitor coupled floating gate poly and source/drain junction formed by low voltage well. The characteristics of the MOSFET depend on the choice of capacitance coupling ratio which is determined by the ratio of MIM (Metal-Insulator-Metal) capacitance and gate oxide capacitance. This means that the proper choice of layout can control the device performances; threshold voltage, ID-VD, and ID-VG characteristics. Some of smart power management ICs requires of a low density non-volatile memory for the purpose of PMIC trimming. To meet this purpose, NVM embedding on PMIC solution should be cost effective. This newly proposed high gate voltage MOSFET with thin gate oxide can be an effective solution for the periphery circuits of single poly EEPROM operation.
Keywords
EPROM; MIM devices; MOSFET; capacitors; random-access storage; MIM capacitor; MOSFET; PMIC application; floating gate poly; high gate voltage; low density nonvolatile memory; metal-insulator-metal capacitance; periphery circuits; power management integrated circuit; single poly EEPROM operation; source/drain junction; thin gate oxide; threshold voltage; Capacitance; Couplings; Logic gates; MIM capacitors; MOSFET circuits; Silicon; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs (ISPSD), 2011 IEEE 23rd International Symposium on
Conference_Location
San Diego, CA
ISSN
1943-653X
Print_ISBN
978-1-4244-8425-6
Type
conf
DOI
10.1109/ISPSD.2011.5890828
Filename
5890828
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