Multichip modules fabrication, a transition from prototypes to production

The author presents an overview of the rationale behind a pilot facility for manufacturing multichip modules, using a high density multilayer interconnect (HDMI) technology. Although HDMI multichip module fabrication equipment and techniques are somewhat related to semiconductor fabrication, there are significant differences which are due to the size of finished parts and to the materials used in the fabrication of MCMs. Past its initial learning curve, minimized costs for second level interconnection are expected from the HDMI technology, because of its optimized geometries compared to other potential second level interconnect technologies. The recently completed pilot facility is to provide data in preparation for the construction of other future large facilities capable of producing parts in large volume, at low cost, for the commercial market. It is pointed out that in order to compete in the world market and to keep a leading edge over competitors, older labor intensive techniques of operating semiconductor plants must be replaced by aggressive automatization