Gold-tin solder electroplating of photo-resist laminated AlN ceramics

Author

Akhlaghi, Siamak ; Broughton, James N. ; Ivey, Douglas G.

Author_Institution

Micralyne Inc., Edmonton, Alta., Canada

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

129

Lastpage

133

Abstract

The eutectic gold-tin solder has been widely used in the optoelectronics/electronics industry. The prominent characteristics of this solder include high thermal fatigue resistance in addition to excellent thermal properties. An electroplating process was used in this study to deposit Au-30Sn (at%) solder on photoresist laminated substrates, based on previous successful attempts at depositing this alloy on unpatterned, metallized substrates. Difficulties were encountered in the course of electroplating photoresist patterned substrates. The problems were resolved by changing the chemistry of the electroplating solution through decreasing the gold:tin ratio. The problems arose because of penetration of the electroplating solution through pinholes in the photoresist, thus increasing the actual opening area for electroplating.

Keywords

aluminium compounds; ceramic packaging; electroplating; eutectic alloys; gold alloys; integrated circuit packaging; laminates; metallisation; photoresists; semiconductor device packaging; soldering; tin alloys; Au-Sn solder electroplating; AuSn-AlN; electronic applications; electroplating solution chemistry; electroplating solution photoresist penetration; eutectic gold-tin solder deposition; gold/tin ratio; metallized substrates; optoelectronic applications; photo-resist laminated AlN ceramics; photoresist laminated substrates; photoresist patterned substrates; photoresist pinholes; solder characteristics; solder thermal properties; thermal fatigue resistance; Bonding; Ceramics; Electronic packaging thermal management; Electronics industry; Fatigue; Metallization; Resists; Thermal resistance; Thermal stresses; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008085

Filename

1008085