DocumentCode :
1692856
Title :
Electronic assembly solvent substitutes
Author :
Sapre, Alex
fYear :
1991
Firstpage :
294
Lastpage :
297
Abstract :
Ways being considered at Hughes Aircraft Company to replace ozone depleting chemicals in the manufacture of electronics hardware are discussed. Organic solvents, saponifier cleaning, the use of terpene solvent cleaning, the reacting aqueous defluxing system, water-soluble fluxes, and tin/lead base solder alloys that will not require fluxes for joining of aerospace electronics are some of the areas being investigated
Keywords :
Aerospace electronics; Aircraft manufacture; Assembly; Chemicals; Cleaning; Hardware; Lead; Manufacturing; Solvents; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
Type :
conf
DOI :
10.1109/IEMT.1991.279799
Filename :
279799
Link To Document :
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