• DocumentCode
    1692939
  • Title

    Design for manufacturability for electronic design: a system for evaluating printed circuit design tradeoffs

  • Author

    Tani, W.

  • Author_Institution
    Hewlett-Packard, Palo Alto, CA, USA
  • fYear
    1991
  • Firstpage
    315
  • Lastpage
    319
  • Abstract
    A system for evaluating printed circuit design (PCD) tradeoffs during the electronic design process has been developed. The system consists of a stand-alone PC-based software tool and support documentation which describes system operation, content, methodology, optimization processes, and printed circuit technology selection criteria. At any stage of the PCD process, the system can be used to evaluate the advantages and disadvantages of potential board design alternatives. Example design tradeoffs include board cost vs. circuit density, electrical performance vs. cost, and cost vs. manufacturability. All tradeoffs are based on a set of models and metrics which predict board density and technology requirements, board cost, fabrication yield, and expected electrical performance ranges. System models and metrics are based on actual production fabrication capabilities. The system´s potential for significantly reducing overall PCD cycle times while simultaneously satisfying overall board design constraints has been demonstrated
  • Keywords
    circuit CAD; printed circuit design; printed circuit manufacture; board density; board design; board design constraints; electrical performance; fabrication yield; manufacturability; optimization processes; overall PCD cycle times; printed circuit design tradeoffs; selection criteria; stand-alone PC-based software tool; support documentation; system operation; Costs; Documentation; Fabrication; Manufacturing; Optimization methods; Predictive models; Printed circuits; Process design; Production systems; Software tools;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-0155-2
  • Type

    conf

  • DOI
    10.1109/IEMT.1991.279804
  • Filename
    279804