• DocumentCode
    1692945
  • Title

    Slow-trapping related current in MOS capacitors during NBTS aging

  • Author

    Deren, Lu

  • Author_Institution
    Inst. of Metall., Acad. Sinica, Shanghai, China
  • Volume
    1
  • fYear
    1995
  • Firstpage
    263
  • Abstract
    A current which is directly related to build-up of positive charge in thermal oxide due to negative bias temperature stress (NBTS) aging in a temperature range from 25°C to 350°C has been observed in MOS capacitors. The current was very noticeable in MOS capacitors which had been exposed to plasma in a magnetron sputtering system or in a reaction ion etching system. It was postulated that the carriers in the current flowing in the oxide consists mainly of holes. Two extreme situations were observed. One was that most of the holes injected in oxide moved a little distance and then were captured by hole traps in the oxide. Another was that most of the injected holes traveled through the whole oxide, arriving at the metal interface and recombing with electrons there. It was found that in negative weak field thermal stimulation current (TSC) measurements performed on a highly charged capacitor, the observed current in an external circuit may flow against the direction of the external bias field. A mechanism which is responsible for the build-up of positive oxide charge and resulting in the slow-trapping related current was proposed
  • Keywords
    MOS capacitors; ageing; electric current; electron-hole recombination; hole traps; thermally stimulated currents; 25 to 350 C; MOS capacitors; NBTS aging; TSC measurements; external bias field; hole traps; magnetron sputtering system; metal interface; negative bias temperature stress; plasma exposure; positive charge buildup; reaction ion etching system; recombination; slow-trapping related current; thermal oxide; thermal stimulation current measurement; Aging; Electron traps; MOS capacitors; Plasma applications; Plasma temperature; Spontaneous emission; Sputter etching; Sputtering; Temperature distribution; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 1995. Proceedings., 1995 20th International Conference on
  • Conference_Location
    Nis
  • Print_ISBN
    0-7803-2786-1
  • Type

    conf

  • DOI
    10.1109/ICMEL.1995.500877
  • Filename
    500877