• DocumentCode
    1692957
  • Title

    Thermal impedance spectroscopy of power modules during power cycling

  • Author

    Henlser, Alexander ; Wingert, Daniel ; Herold, Christian ; Lutz, Josef ; Thoben, Markus

  • Author_Institution
    Chemnitz Univ. of Technol., Chemnitz, Germany
  • fYear
    2011
  • Firstpage
    264
  • Lastpage
    267
  • Abstract
    The presented thermal impedance spectroscopy of power modules simplifies significantly the failure analysis of power modules. It enables online observation of degradation within the cooling path with detailed information about failure mechanisms. The degradation of certain layer within the power module is detected by observation of Zth parameters. Several tests results are compared with analysis of the scanning acoustic microscope.
  • Keywords
    acoustic microscopes; cooling; failure analysis; power semiconductor devices; cooling path; failure analysis; failure mechanisms; power cycling; power modules; scanning acoustic microscope; thermal impedance spectroscopy; Degradation; Impedance; Junctions; Multichip modules; Temperature measurement; Thermal analysis; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs (ISPSD), 2011 IEEE 23rd International Symposium on
  • Conference_Location
    San Diego, CA
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4244-8425-6
  • Type

    conf

  • DOI
    10.1109/ISPSD.2011.5890841
  • Filename
    5890841
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1692957