Title :
A software tool for technology tradeoff evaluation in multichip packaging
Author :
Sandborn, Peter A.
Author_Institution :
Microelectronics & Computer Technology Corp., Austin, TX, USA
Abstract :
A software tool for evaluating performance tradeoffs in multichip packaging is described. The tool enhances the manufacturability and decreases the design risk associated with the selection of packaging technologies for integrated circuits. Geometric, electrical, thermal, and manufacturing metrics can be estimated using the tool. The tool allows technologies to be changed and design rules to be modified using a what if approach. The role of technology tradeoff analysis in multichip system design and system compiler concepts are discussed, and implementation details of the present tool are described. A design example of a RISC processor module is presented, and the use of the tool for assessing mixed technology systems is demonstrated
Keywords :
electronic engineering computing; integrated circuit technology; modules; packaging; MCM; RISC processor module; integrated circuits; manufacturability; mixed technology systems; multichip packaging; performance tradeoffs; software tool; system compiler; technology tradeoff evaluation; Appropriate technology; Design automation; Design methodology; Integrated circuit packaging; Integrated circuit technology; Manufacturing; Performance loss; Software packages; Software tools; Space technology;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
DOI :
10.1109/IEMT.1991.279809
