DocumentCode
1693081
Title
Dynamic Maintenance in semiconductor manufacturing using Bayesian networks
Author
Kurz, Daniel ; Kaspar, Johannes ; Pilz, Jürgen
Author_Institution
Infineon Technol. Austria, Alpen-Adria Univ. of Klagenfurt, Austria
fYear
2011
Firstpage
238
Lastpage
243
Abstract
In semiconductor manufacturing, in order to guarantee an optimal production flow it is necessary to perform a quick and correct equipment repair when an error message occurs. Since most equipment types are very complex, maintenance engineers are provided with manuals of troubleshooting flow charts. These manuals offer guidelines for finding the cause of the problem. Since such manuals are often static, clumsy and difficult to extend, it might be hard for maintenance engineers to efficiently perform cause-effect testing. For this reason, we employed a Bayesian network model that is developed from troubleshooting flow charts, which is able to overcome these deficiencies. The network is built as a self-learning diagnostic system. Troubleshooting sessions are used to train the network, so that the order of potential root causes is dynamically updated by actual maintenance experience. An Expectation Maximization (EM) algorithm is used to update the network. Furthermore, by ordering symptoms according to a mutual information criterion, it is possible to provide maintenance engineers with a ranking of the most informative and efficient tests to run.
Keywords
belief networks; expectation-maximisation algorithm; maintenance engineering; production engineering computing; semiconductor industry; Bayesian network; dynamic maintenance; equipment repair; expectation maximization algorithm; optimal production flow; self-learning diagnostic system; semiconductor manufacturing; troubleshooting session; Bayesian methods; Circuit faults; Knowledge engineering; Maintenance engineering; Mutual information; Probability distribution; Random variables;
fLanguage
English
Publisher
ieee
Conference_Titel
Automation Science and Engineering (CASE), 2011 IEEE Conference on
Conference_Location
Trieste
ISSN
2161-8070
Print_ISBN
978-1-4577-1730-7
Electronic_ISBN
2161-8070
Type
conf
DOI
10.1109/CASE.2011.6042404
Filename
6042404
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