DocumentCode
169321
Title
Table of contents
fYear
2014
fDate
19-21 May 2014
Firstpage
1
Lastpage
8
Abstract
The following topics are dealt with: Yield Enhancement; Advanced Metrology; 3D/TSV; Advanced Process Control; Factory Optimization; Defect Inspection; Equipment Reliability and Productivity Enhancement; Contamination Free Manufacturing; Data and Yield Management; Discrete Power Devices/Emerging Technologies; Advanced Patterning/DFM; and Advanced Equipment and Materials.
Keywords
inspection; integrated circuit yield; process control; semiconductor device manufacture; three-dimensional integrated circuits; 3D TSV; advanced equipment; advanced materials; advanced metrology; advanced patterning; advanced process control; contamination free manufacturing; data management; defect inspection; discrete power devices; equipment reliability; factory optimization; productivity enhancement; yield enhancement; yield management;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location
Saratoga Springs, NY
Type
conf
DOI
10.1109/ASMC.2014.6846944
Filename
6846944
Link To Document