Polyquinoline coatings and films: improved organic dielectrics for IC´s and MCM´s

It is pointed out that polymers intended for use in electronics applications must meet a diverse set of stringent requirements on their mechanical, physical, chemical, and electronic properties. New polyquinolines, developed at Maxdem, possess outstanding properties across the board, making them ideal candidates for applications in the electronics industry. These polymers are characterized by excellent thermal and oxidative stability, very low moisture absorption and very low dielectric constant. One member of the family of polyquinolines, PQ-100, is currently under evaluation for use as an interlayer dielectric in high density interconnect applications, including multichip modules. PQ-100 can be cast into free standing films or spin coated to form high-quality coatings on silicon or other surfaces. Films of PQ-100 display a very low thermal expansion coefficient, and extremely low residual stress on silicon substrates. PQ-100 outperforms polyimides in these and other areas critical to high speed, high density packaging