Title :
A novel power system in package with 3D chip on chip interconnections of the power transistor and its gate driver
Author :
Timothé, Simonot ; Nicolas, Rouger ; Jean-Christophe, Crebier ; Victor, Gaude ; Pheng, Irène
Author_Institution :
Grenoble Electr. Eng. Lab., Grenoble Univ., St. Martin d´´Hères, France
Abstract :
Currently, most industrial power modules, even IPEMs (Intelligent Power Electronics Modules), are interconnected in a planar way, and interconnections are made with bonding wires. This paper presents a three dimensional interconnection solution based on the idea to flip chip the gate driver directly on the surface of the power device, simplifying and optimizing the packaging and the interconnections among the two devices and improving the overall performances. Various approaches and interconnection solutions will be presented in this paper, and the advantages of the chosen approach will be discussed. Then the technological process for the realization of the interconnections will be explained, and practical realizations will be shown.
Keywords :
chip scale packaging; driver circuits; flip-chip devices; integrated circuit interconnections; power electronics; power transistors; 3D chip; IPEM; bonding wires; chip interconnections; flip chip; gate driver; industrial power modules; intelligent power electronics modules; package; planar interconnections; power device; power system; power transistor; Assembly; Copper; Driver circuits; Flip chip; Gold; Logic gates; Wires;
Conference_Titel :
Power Semiconductor Devices and ICs (ISPSD), 2011 IEEE 23rd International Symposium on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-8425-6
DOI :
10.1109/ISPSD.2011.5890857
