Title :
Robust-design of a metallization process for ceramic substrates
Author :
Law, H.H. ; Mattoe, C.A. ; Thomson, J., Jr. ; Smith, T.E. ; Zappula, R.
Author_Institution :
AT&T Bell Lab., Murray Hill, NJ, USA
Abstract :
The electroless nickel deposition process on ceramic substrates was optimized using a Taguchi-based robust-design method. The plating parameter settings were obtained in only 27 experiments. The savings in experiments is significant when compared to a full factorial design of 486 runs. The yield of completely metallized substrate was increased substantially. Under the optimal conditions, a 100% yield was obtained in the confirmation run of 80 ceramic samples
Keywords :
ceramics; electroless deposition; integrated circuit technology; metallisation; nickel; substrates; Taguchi-based robust-design method; ceramic substrates; electroless Ni deposition process; metallization process; metallized substrate; plating parameter settings; Ceramics; Cleaning; Design methodology; Electronic components; Manufacturing; Metallization; Nickel; Palladium; Robustness; Water pollution;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
DOI :
10.1109/IEMT.1991.279819
