Title :
Environment dependence of analog matching and design-process optimization on a 28LP SoC technology for smart mobile devices
Author :
Cai, M. ; Sengupta, Sabyasachi ; Choi, Jang-Young ; Qi, Wenjin ; Wang, Huifang ; Huang, Victor ; Alladi, Dinesh ; Yuan, Dongfeng ; Chidambaram, P. ; Yeap, Geoffrey
Author_Institution :
Qualcomm Technol. Inc., San Diego, CA, USA
Abstract :
Mismatch of analog circuits designed for mobile devices are studied with nanoprobing, pattern density, and inline monitoring using a 28LP SoC technology. Active layer density was found to be the root cause of high mismatch variation. Design guidelines, along with an interleaved design, are shown to improve mismatch for a given process flow.
Keywords :
analogue circuits; circuit optimisation; integrated circuit design; low-power electronics; smart phones; system-on-chip; 28LP SoC technology; active layer density; analog circuits; analog matching; design guidelines; design-process optimization; environment dependence; inline monitoring; interleaved design; mismatch variation; nanoprobing; pattern density; process flow; smart mobile devices; Analog circuits; Annealing; Layout; Mobile handsets; Resistors; System-on-chip; Temperature measurement; DFM; System on chip; analog circuits; design optimization; manufacturing process;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location :
Saratoga Springs, NY
DOI :
10.1109/ASMC.2014.6846958
