Cost saving opportunities with multi-chip modules

The author describes an MCM (multi-chip module) application that was driven by cost. A study of MCM technologies focused on the MCM assembly and interconnect to the motherboard. Models were developed to calculate the assembly and test costs for MCMs using wirebond and tape automated bonding technologies. Another model was used to evaluate interconnect options, both separable and nonseparable (e.g., soldered). The cost analysis verified that significant cost savings could be achieved by using MCM technology and, along with a technical evaluation of the alternatives, led to an MCM physical design for this application