• DocumentCode
    1693542
  • Title

    In-process checking of carrier lifetime distribution in high-power devices

  • Author

    Benda, V.

  • Author_Institution
    Fac. of Electr. Eng., Czech Tech. Univ., Prague, Czech Republic
  • Volume
    1
  • fYear
    1995
  • Firstpage
    403
  • Abstract
    Nonuniform distribution of carrier lifetime over the area of power semiconductor devices results in a nonuniform distribution of on-state current density and consequently, in a nonuniform distribution of power dissipation during device operation, which results in nonuniform temperature distribution that can negatively influence the device reliability. In the presented paper, a method for determining carrier lifetime distribution over the area of power devices is described. The method is relatively simple and its application is easy so that it can be used for in-process checking of carrier lifetime distribution in large-area power devices structures after different steps of device fabrication
  • Keywords
    carrier lifetime; current density; electric variables measurement; power semiconductor devices; production testing; semiconductor device testing; temperature distribution; carrier lifetime distribution; device reliability; high-power devices; in-process checking; large-area power devices structures; nonuniform distribution; nonuniform temperature distribution; onstate current density; power dissipation; power semiconductor devices; Charge carrier lifetime; Current density; Energy states; Fabrication; Power dissipation; Power semiconductor devices; Radiative recombination; Silicon; Temperature distribution; Thyristors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 1995. Proceedings., 1995 20th International Conference on
  • Conference_Location
    Nis
  • Print_ISBN
    0-7803-2786-1
  • Type

    conf

  • DOI
    10.1109/ICMEL.1995.500900
  • Filename
    500900