DocumentCode
1693542
Title
In-process checking of carrier lifetime distribution in high-power devices
Author
Benda, V.
Author_Institution
Fac. of Electr. Eng., Czech Tech. Univ., Prague, Czech Republic
Volume
1
fYear
1995
Firstpage
403
Abstract
Nonuniform distribution of carrier lifetime over the area of power semiconductor devices results in a nonuniform distribution of on-state current density and consequently, in a nonuniform distribution of power dissipation during device operation, which results in nonuniform temperature distribution that can negatively influence the device reliability. In the presented paper, a method for determining carrier lifetime distribution over the area of power devices is described. The method is relatively simple and its application is easy so that it can be used for in-process checking of carrier lifetime distribution in large-area power devices structures after different steps of device fabrication
Keywords
carrier lifetime; current density; electric variables measurement; power semiconductor devices; production testing; semiconductor device testing; temperature distribution; carrier lifetime distribution; device reliability; high-power devices; in-process checking; large-area power devices structures; nonuniform distribution; nonuniform temperature distribution; onstate current density; power dissipation; power semiconductor devices; Charge carrier lifetime; Current density; Energy states; Fabrication; Power dissipation; Power semiconductor devices; Radiative recombination; Silicon; Temperature distribution; Thyristors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 1995. Proceedings., 1995 20th International Conference on
Conference_Location
Nis
Print_ISBN
0-7803-2786-1
Type
conf
DOI
10.1109/ICMEL.1995.500900
Filename
500900
Link To Document