Title :
A pilot line for multichip modules substrates
Author :
Droguet, Jean-Paul
Author_Institution :
Thomson Hybrides, Massy, France
Abstract :
In 1990 Thomson Hybrides started design and installation of a pilot production line for high density thin film substrates. Copper/polyimide multilayer structures are processed on alumina substrates. Vacuum metallization, electroplating, and photolithography processes will be progressively transferred to new automatic equipment. Starting with standard square plates (4"×4"), the pilot line has been designed to be compatible with sizes up to 6"×6". The industrial approach is explained here. The pilot line is described in relation to the manufacturing cycle and process engineering. How the quality and yield should be affected by automatic processing is discussed
Keywords :
electroplating; hybrid integrated circuits; integrated circuit manufacture; manufacturing computer control; metallisation; photolithography; substrates; Al2O3; Thomson Hybrides; automatic equipment; copper-polyimide multilayers; electroplating; high density thin film substrates; manufacturing cycle; metallization; multichip modules substrates; photolithography; pilot production line; process engineering; quality; yield; Copper; Industrial relations; Lithography; Metallization; Multichip modules; Nonhomogeneous media; Polyimides; Production; Substrates; Transistors;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-0155-2
DOI :
10.1109/IEMT.1991.279829
