A pilot line for multichip modules substrates

Author

Droguet, Jean-Paul

Author_Institution

Thomson Hybrides, Massy, France

fYear

1991

Firstpage

420

Lastpage

423

Abstract

In 1990 Thomson Hybrides started design and installation of a pilot production line for high density thin film substrates. Copper/polyimide multilayer structures are processed on alumina substrates. Vacuum metallization, electroplating, and photolithography processes will be progressively transferred to new automatic equipment. Starting with standard square plates (4"×4"), the pilot line has been designed to be compatible with sizes up to 6"×6". The industrial approach is explained here. The pilot line is described in relation to the manufacturing cycle and process engineering. How the quality and yield should be affected by automatic processing is discussed

Keywords

electroplating; hybrid integrated circuits; integrated circuit manufacture; manufacturing computer control; metallisation; photolithography; substrates; Al₂O₃; Thomson Hybrides; automatic equipment; copper-polyimide multilayers; electroplating; high density thin film substrates; manufacturing cycle; metallization; multichip modules substrates; photolithography; pilot production line; process engineering; quality; yield; Copper; Industrial relations; Lithography; Metallization; Multichip modules; Nonhomogeneous media; Polyimides; Production; Substrates; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-0155-2

Type

conf

DOI

10.1109/IEMT.1991.279829

Filename

279829