Title :
Regression methods for prediction of PECVD Silicon Nitride layer thickness
Author :
Purwins, Hendrik ; Nagi, Ahmed ; Barak, Bernd ; Höckele, Uwe ; Kyek, Andreas ; Lenz, Benjamin ; Pfeifer, Günter ; Weinzierl, Kurt
Author_Institution :
PMC Technol. GmbH, Munster, Germany
Abstract :
Different approaches for the prediction of average Silicon Nitride cap layer thickness for the Plasma Enhanced Chemical Vapor Deposition (PECVD) dual-layer metal passivation stack process are compared, based on metrology and production equipment Fault Detection and Classification (FDC) data. Various sets of FDC parameters are processed by different prediction algorithms. In particular, the use of high-dimensional multivariate input data in comparison to small parameter sets is assessed. As prediction methods, Simple Linear Regression, Multiple Linear Regression, Partial Least Square Regression, and Ridge Linear Regression utilizing the Partial Least Square Estimate algorithm are compared. Regression parameter optimization and model selection is performed and evaluated via cross validation and grid search, using the Root Mean Squared Error. Process expert knowledge used for a priori selection of FDC parameters further enhances the performance. Our results indicate that Virtual Metrology can benefit from the usage of regression methods exploiting collinearity combined with comprehensive process expert knowledge.
Keywords :
fault diagnosis; least squares approximations; mean square error methods; passivation; plasma CVD; regression analysis; silicon compounds; FDC data; PECVD layer thickness prediction; SiN; comprehensive process expert knowledge; dual-layer metal passivation stack process; fault detection and classification data; high-dimensional multivariate input data; multiple linear regression; partial least square estimate algorithm; partial least square regression; plasma enhanced chemical vapor deposition; regression parameter optimization; ridge linear regression; root mean squared error; simple linear regression; virtual metrology; Context; Linear regression; Predictive models; Process control; Production; Silicon; Thickness measurement;
Conference_Titel :
Automation Science and Engineering (CASE), 2011 IEEE Conference on
Conference_Location :
Trieste
Print_ISBN :
978-1-4577-1730-7
Electronic_ISBN :
2161-8070
DOI :
10.1109/CASE.2011.6042426