DocumentCode
1693645
Title
Prober for highly integrated multichip modules
Author
Sakata, Tomoaki ; Numata, Kiyoshi
Author_Institution
Hitachi Ltd., Yokohama, Japan
fYear
1991
Firstpage
429
Lastpage
433
Abstract
A prober for function test of LSIs on multichip modules of Hitachi´s newest mainframe M-880 series has been developed. The test is performed by making contact between probes and metallic pads on the module substrate. A visual feedback positioning system is employed to position a probe head, in which the probes are installed, precisely on the module. The prober has four TV cameras to compensate for the location error of module mounting, the location error of probe head holding, and thermal deformation of the module and the prober. Control values of the positioning table, which carries the probe head to a testing point, are calculated by some coordinate transformations with the use of the TV cameras´ outputs and position data measured in the fabrication process of the module and the probe head
Keywords
hybrid integrated circuits; integrated circuit testing; probes; television applications; Hitachi M-880 series mainframe; LSIs; TV cameras; coordinate transformations; function test; module mounting; module substrate; multichip modules; positioning table; probe head holding; prober; thermal deformation; visual feedback positioning system; Cameras; Coordinate measuring machines; Fabrication; Feedback; Multichip modules; Performance evaluation; Position measurement; Probes; TV; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-0155-2
Type
conf
DOI
10.1109/IEMT.1991.279831
Filename
279831
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