Title :
High-k/metal gates in the 2010s
Author_Institution :
Chipworks Inc., Ottawa, ON, Canada
Abstract :
2007 saw the introduction of the first high-k/metal gate (HKMG) devices into the marketplace. This marked the return of metal-gate technology on silicon for the first time since polysilicon gates became ubiquitous in the early 1970s. Intel was the first to use high-k/metal gate in its 45-nm product. Other leading-edge manufacturers have now launched HKMG products in both gate-first and gate-last forms at the 28-nm node, and we have seen the first HKMG finFET products from Intel. In the near future we also expect to see the first 20-nm foundry products come onto the market. Chipworks, as a supplier of competitive intelligence to the semiconductor and electronics industries, monitors the evolution of chip processes as they come into commercial production. Chipworks has obtained parts from the leading edge manufacturers, and performed structural analyses to examine the features and manufacturing processes of the devices. The paper discusses some of the different transistor structures we have seen during the evolution of the HKMG technology, and examines the variety of 32/28-nm parts that have been introduced. We will also show more details of the Intel 22-nm finFETs.
Keywords :
MOSFET; elemental semiconductors; high-k dielectric thin films; manufacturing processes; semiconductor industry; silicon; AD 2010; Chipworks; HKMG devices; HKMG finFET products; Intel finFET; Si; electronics industry; feature process; foundry products; high-k-metal gates; launched HKMG products; leading-edge manufacturers; manufacturing process; metal-gate technology; polysilicon gates; semiconductor industry; size 20 nm; size 22 nm; size 28 nm; size 32 nm; size 45 nm; structural analysis; High K dielectric materials; Logic gates; MOSFET; Silicon germanium; Tin; Advanced Materials; Advanced Processes; FEOL; Transistor Structures;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location :
Saratoga Springs, NY
DOI :
10.1109/ASMC.2014.6846970