DocumentCode :
1693987
Title :
Role of dielectric material and geometry on the thermo-mechanical reliability of microvias
Author :
Ramakrishna, Gnyaneshwar ; Liu, Fuhan ; Sitaraman, Suresh K.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
439
Lastpage :
445
Abstract :
A comprehensive experimental and theoretical program is underway at the Georgia Institute of Technology to develop microvia substrate technology. The experimental aspect of this program involves fabrication in a class 1000 clean room facility to understand the effect of process parameters on yield and reliability of the microvia and high density wiring (HDW) structures. The theoretical program aims to understand the mechanics of deformation and thus predict and enhance the reliability of the HDW structures. The focus of this paper is to understand the effect of processing parameters on yield, to characterize the effect of microvia geometry parameters on the evolution of strain, and to determine the effect of dielectric material properties on the thermo-mechanical reliability of the microvias. Finite element simulations were carried out with different microvia diameters to understand the failure mechanisms of these structures. The reliability predictions are compared with thermal cycling test data of the test vehicles.
Keywords :
chip scale packaging; circuit reliability; dielectric materials; failure analysis; fine-pitch technology; finite element analysis; flip-chip devices; printed circuits; chip scale packages; deformation mechanics; dielectric material properties; failure mechanisms; fine-pitch area-array packages; finite element simulations; flip chips; high density wiring structures; microvia diameters; microvia geometry parameters; microvia substrate technology; microvias; process simulations; processing parameters; reliability; strain evolution; thermal cycling test data; thermo-mechanical reliability; yield; Capacitive sensors; Dielectric materials; Dielectric substrates; Fabrication; Geometry; Materials reliability; Reliability theory; Testing; Thermomechanical processes; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN :
0569-5503
Print_ISBN :
0-7803-7430-4
Type :
conf
DOI :
10.1109/ECTC.2002.1008133
Filename :
1008133
Link To Document :
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