Title :
Selection of optimal materials and geometry for reliability of high density wiring substrates
Author :
Hegde, Shashikant ; Pucha, Raghuram V. ; Sitaraman, Suresh K.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
6/24/1905 12:00:00 AM
Abstract :
The thermomechanical response of multi-layered High Density Wiring (HDW) substrates is influenced by various material and geometrical parameters. This study aims at understanding the role and interaction of various base substrate and dielectric materials on the different failure mechanisms. Non-linear finite element models are developed to estimate the warpage of the substrate, stresses in the dielectric layer and solder ball strains. The input factors for the analysis are grouped under material properties and geometry, and a selection technique is used to identify important factors. Based on the study, a response surface is generated to understand the role and interaction of input parameters on various failure mechanisms, and such a response surface will be used to tailor material properties for the HDW structures.
Keywords :
chip-on-board packaging; circuit reliability; dielectric materials; failure analysis; finite element analysis; flip-chip devices; soldering; substrates; surface fitting; thermal expansion; thermal stresses; base substrate materials; coefficient of thermal expansion; dielectric materials; failure mechanisms; flip chip assembly on board; geometry; high density wiring substrates; multi-layered HDW substrates; nonlinear finite element models; reliability; response surface; selection technique; solder ball strains; substrate warpage; thermomechanical response; Dielectric materials; Dielectric substrates; Failure analysis; Finite element methods; Geometry; Material properties; Materials reliability; Response surface methodology; Thermomechanical processes; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008134
