• DocumentCode
    169414
  • Title

    Improvement of characteristic of redistribution layer (RDL)on mobile application

  • Author

    Liu, C.S. ; Ann Hsu ; Ni, C.T. ; Pang, Ponder ; Lo, Julia ; Su, Wenjing ; Ku, Harry

  • Author_Institution
    Backend Integration Dev. Dept., Taiwan Semicond. Manuf. Co. Ltd., Tainan, Taiwan
  • fYear
    2014
  • fDate
    19-21 May 2014
  • Firstpage
    172
  • Lastpage
    175
  • Abstract
    The application of metal redistribution layer (RDL) for the mobile application and its improvement are presented in this paper. These experiment designs are carried out to determine the optimal sputtering and pre-treatment conditions of the metal redistribution layers before the wire bonding process though the studies of surface morphology and phase transformation. In addition, a notable improvement of visual inspection is demonstrated by these optimal process conditions. From these experimental results, two types of RDL non-uniform defects were formed during the sputtering and pre-treatment process. By sputtering deposition process control and optimizing the pre-treatment process time, these two RDL non-uniform defects ration can be reduce to 10% of original. Another key index of assembly process, the shear strengths of wire-bonding bondability test can also be obtained a significant improvement by using these optimal process conditions.
  • Keywords
    lead bonding; metals; phase transformations; process control; sputtering; surface morphology; surface treatment; metal redistribution layer; mobile application; optimal sputtering; phase transformation; sputtering deposition process control; surface morphology; visual inspection; wire bonding process; Bonding; Metals; Sputtering; Surface cleaning; Surface morphology; Wires; Bondability; Redistribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
  • Conference_Location
    Saratoga Springs, NY
  • Type

    conf

  • DOI
    10.1109/ASMC.2014.6846992
  • Filename
    6846992