DocumentCode
169414
Title
Improvement of characteristic of redistribution layer (RDL)on mobile application
Author
Liu, C.S. ; Ann Hsu ; Ni, C.T. ; Pang, Ponder ; Lo, Julia ; Su, Wenjing ; Ku, Harry
Author_Institution
Backend Integration Dev. Dept., Taiwan Semicond. Manuf. Co. Ltd., Tainan, Taiwan
fYear
2014
fDate
19-21 May 2014
Firstpage
172
Lastpage
175
Abstract
The application of metal redistribution layer (RDL) for the mobile application and its improvement are presented in this paper. These experiment designs are carried out to determine the optimal sputtering and pre-treatment conditions of the metal redistribution layers before the wire bonding process though the studies of surface morphology and phase transformation. In addition, a notable improvement of visual inspection is demonstrated by these optimal process conditions. From these experimental results, two types of RDL non-uniform defects were formed during the sputtering and pre-treatment process. By sputtering deposition process control and optimizing the pre-treatment process time, these two RDL non-uniform defects ration can be reduce to 10% of original. Another key index of assembly process, the shear strengths of wire-bonding bondability test can also be obtained a significant improvement by using these optimal process conditions.
Keywords
lead bonding; metals; phase transformations; process control; sputtering; surface morphology; surface treatment; metal redistribution layer; mobile application; optimal sputtering; phase transformation; sputtering deposition process control; surface morphology; visual inspection; wire bonding process; Bonding; Metals; Sputtering; Surface cleaning; Surface morphology; Wires; Bondability; Redistribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location
Saratoga Springs, NY
Type
conf
DOI
10.1109/ASMC.2014.6846992
Filename
6846992
Link To Document