DocumentCode :
1694342
Title :
Special mechanisms in thin film SOI MOSFETs
Author :
Balestra, F. ; Cristoloveanu, S.
Author_Institution :
Lab. de Phys. des Composants a Semicond., ENSERG, Grenoble, France
Volume :
2
fYear :
1995
Firstpage :
623
Abstract :
A review of the main special mechanisms in thin film SOI MOSFETs is given. The influence of the most important technological and electrical parameters, such as the film and buried oxide thicknesses, film and silicon substrate doping, channel length, substrate bias and interface defects, is discussed. The improvement of the electrical properties in the case of fully depleted thin film SOI MOS transistors, especially the driving current and the subthreshold swing, is addressed. We investigate, on one hand, the advantages of thin-film SOI devices in relation with scaling down rules down to deep submicron transistors, and, on the other hand, the main parasitic phenomena, such as the kink, latch, breakdown, self-heating and hot-carrier degradation effects. Finally, the low temperature properties and quantum effects are outlined
Keywords :
MOSFET; buried layers; cryogenic electronics; doping profiles; electric breakdown; hot carriers; interface states; reviews; silicon-on-insulator; thin film transistors; Si substrate doping; Si-SiO2; breakdown; buried oxide thickness; channel length; deep submicron transistors; electrical parameters; film doping; film thickness; fully depleted thin film; hot-carrier degradation; interface defects; kink effect; latch effect; low temperature properties; parasitic phenomena; quantum effects; scaling down rules; self-heating; special mechanisms; substrate bias; subthreshold swing; thin film SOI MOSFETs; Doping; Electric breakdown; Hot carrier effects; Hot carriers; MOSFETs; Semiconductor films; Silicon; Substrates; Thin film devices; Thin film transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics, 1995. Proceedings., 1995 20th International Conference on
Conference_Location :
Nis
Print_ISBN :
0-7803-2786-1
Type :
conf
DOI :
10.1109/ICMEL.1995.500939
Filename :
500939
Link To Document :
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