Title :
Air Gap CV measurement for doping concentration in epitaxial silicon
Author :
Heider, Franz ; Baumgartl, Johannes ; Horvath, Peter ; Jaehrling, Thomas
Author_Institution :
Unit Process Dev., Infineon Technol. Austria AG, Villach, Austria
Abstract :
Epitaxial silicon layers with low and intermediate resistivity were investigated with a contact-free capacitance versus voltage method. The low resistivity sample with 0.15 Ohm cm had long-term repeatability and reproducibility over 3 days with a fractional standard deviation of 0.8%. The intermediate resistivity epi layer with 6.2 Ohm cm had a long term repeatability with a fractional standard deviation of 0.16%. The fully automated CV tool measures with an electrode 0.5 μm above the wafer surface. A particle detection system ensures that there are no defects at the measurement site. This non-contact method has clear advantages over conventional methods such as mercury-CV or four-point-probe for determining doping concentration and doping depth profiles.
Keywords :
air gaps; capacitance measurement; doping profiles; electrical resistivity; epitaxial layers; silicon; voltage measurement; Si; air gap CV measurement; contact-free capacitance versus voltage method; distance 0.5 mum; doping concentration; doping depth profiles; epitaxial silicon layers; four-point-probe; fractional standard deviation; fully automated CV tool; intermediate resistivity epi layer; long-term repeatability; low resistivity sample; mercury-CV; noncontact method; particle detection system; reproducibility; wafer surface; Conductivity; Doping; Pollution measurement; Semiconductor device measurement; Standards; Surface treatment; Voltage measurement; capacitance-voltage; contact-free CV; doping profile; epitaxial silicon; mercury-CV; metrology; resistivity profile;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location :
Saratoga Springs, NY
DOI :
10.1109/ASMC.2014.6847015