DocumentCode
169457
Title
Addressing thin film thickness metrology challenges of 14nm BEOL layers
Author
Zhiming Jiang ; Haupt, Randy ; Ygartua, Carlos ; Vaid, Alok ; Lenahan, Michael ; Seshachalam, V.
Author_Institution
KLA-Tencor Corp., Milpitas, CA, USA
fYear
2014
fDate
19-21 May 2014
Firstpage
257
Lastpage
260
Abstract
In this paper we discuss the impact of these two effects on the film thickness measurement and describe our approach to develop a film stack model and recipe which accounts for the underlying stack as well as Chemical Mechanical Planarization (CMP) variation. We also describe the verification and production implementation of this model using mass production data.
Keywords
chemical mechanical polishing; mass production; planarisation; thickness measurement; BEOL layers; CMP; chemical mechanical planarization; film stack; mass production data; production implementation; size 14 nm; thin film thickness metrology; underlying stack; verification implementation; Dispersion; Films; Fitting; Metals; Semiconductor device measurement; Semiconductor device modeling; Thickness measurement; Chemical Mechanical Planarization (CMP); Film stack; Spectroscopic Ellipsometer;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location
Saratoga Springs, NY
Type
conf
DOI
10.1109/ASMC.2014.6847016
Filename
6847016
Link To Document