Title :
450mm metrology and inspection: The current state and the road ahead
Author :
Cottle, Rand ; Yathapu, Nithin ; Sieg, Katherine
Author_Institution :
Coll. of Nanoscale Sci. & Eng., SUNY, New York, NY, USA
Abstract :
450mm metrology is off to a great start. Early test wafer tools have provided all the basic characterization techniques needed for ETW pilot line demonstration, but, recent changes to 450mm HVM insertion strategy have presented new challenges. This paper provides an update to the current state of 450mm metrology, highlights some of the challenges the 450mm transition has presented, discusses some proposed new or modified standards for 450mm, and outlines future work planned by G450C and its collaboration partners.
Keywords :
batch processing (industrial); inspection; semiconductor device manufacture; semiconductor device measurement; ETW pilot line demonstration; HVM insertion strategy; early test wafer tools; high-volume manufacturing; inspection; metrology; size 450 mm; Automation; Ellipsometry; Films; Inspection; Metrology; Pollution measurement; Standards; 450mm; advanced equipment and materials processes; advanced metrology and inspection; equipment reliability and productivity enhancements;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location :
Saratoga Springs, NY
DOI :
10.1109/ASMC.2014.6847018
