• DocumentCode
    1694705
  • Title

    Dynamic modeling and measurement of personal computer motherboards

  • Author

    Pitarresi, J. ; Geng, Phil ; Beltman, Willem ; Ling, Yun

  • Author_Institution
    Dept. of Mech. Eng., Binghamton Univ., NY, USA
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    597
  • Lastpage
    603
  • Abstract
    This paper addresses basic modeling issues regarding the mechanical shock and random vibration response of a typical personal computer motherboard. Finite element modeling of an ATX-style motherboard was used to estimate the modal characteristics and dynamic response. Locally stiffened regions, such as sockets and large components, were modeled as simple blocks. The elastic modulus for these regions was determined by performing a 3-point bend tests on samples removed from the motherboard. The mode shapes and natural frequencies of the motherboard were computed and correlated with measurement. The dynamic response, due to random base excitation of the motherboard, was predicted by the model and showed very good correlation with measured acceleration response values. Mechanical shock response analysis was approached using two methods: direct time integration and the shock response spectrum method. Both provided good correlation with the measured peak acceleration response to an applied half-sine shock pulse. In addition, the predicted transient response was well correlated with acceleration time history measurements made during shock loading. It was observed that the shock response was dominated by the fundamental mode of the motherboard. Simple guidelines are presented for modeling of personal computer motherboards subjected to random base excitation and shock loads.
  • Keywords
    acceleration measurement; dynamic testing; electronic engineering computing; finite element analysis; integration; microcomputers; modal analysis; printed circuit testing; shock measurement; vibration measurement; ATX-style motherboard finite element modeling; PC motherboards; acceleration time history measurements; bend tests; direct time integration analysis; half-sine shock pulse; locally stiffened regions; mechanical shock dynamic modeling; mechanical shock response analysis; motherboard components; motherboard dynamic response; motherboard fundamental mode; motherboard modal characteristics; motherboard mode shapes; motherboard natural frequencies computation; motherboard sockets; peak acceleration response; personal computer motherboards; random base excitation; random vibration response; region elastic modulus; shock loading; shock response spectrum methods; simple block modeling; transient response; Acceleration; Accelerometers; Electric shock; Finite element methods; Microcomputers; Performance evaluation; Pulse measurements; Shape measurement; Sockets; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2002. Proceedings. 52nd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7430-4
  • Type

    conf

  • DOI
    10.1109/ECTC.2002.1008156
  • Filename
    1008156