DocumentCode
1694705
Title
Dynamic modeling and measurement of personal computer motherboards
Author
Pitarresi, J. ; Geng, Phil ; Beltman, Willem ; Ling, Yun
Author_Institution
Dept. of Mech. Eng., Binghamton Univ., NY, USA
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
597
Lastpage
603
Abstract
This paper addresses basic modeling issues regarding the mechanical shock and random vibration response of a typical personal computer motherboard. Finite element modeling of an ATX-style motherboard was used to estimate the modal characteristics and dynamic response. Locally stiffened regions, such as sockets and large components, were modeled as simple blocks. The elastic modulus for these regions was determined by performing a 3-point bend tests on samples removed from the motherboard. The mode shapes and natural frequencies of the motherboard were computed and correlated with measurement. The dynamic response, due to random base excitation of the motherboard, was predicted by the model and showed very good correlation with measured acceleration response values. Mechanical shock response analysis was approached using two methods: direct time integration and the shock response spectrum method. Both provided good correlation with the measured peak acceleration response to an applied half-sine shock pulse. In addition, the predicted transient response was well correlated with acceleration time history measurements made during shock loading. It was observed that the shock response was dominated by the fundamental mode of the motherboard. Simple guidelines are presented for modeling of personal computer motherboards subjected to random base excitation and shock loads.
Keywords
acceleration measurement; dynamic testing; electronic engineering computing; finite element analysis; integration; microcomputers; modal analysis; printed circuit testing; shock measurement; vibration measurement; ATX-style motherboard finite element modeling; PC motherboards; acceleration time history measurements; bend tests; direct time integration analysis; half-sine shock pulse; locally stiffened regions; mechanical shock dynamic modeling; mechanical shock response analysis; motherboard components; motherboard dynamic response; motherboard fundamental mode; motherboard modal characteristics; motherboard mode shapes; motherboard natural frequencies computation; motherboard sockets; peak acceleration response; personal computer motherboards; random base excitation; random vibration response; region elastic modulus; shock loading; shock response spectrum methods; simple block modeling; transient response; Acceleration; Accelerometers; Electric shock; Finite element methods; Microcomputers; Performance evaluation; Pulse measurements; Shape measurement; Sockets; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008156
Filename
1008156
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