DocumentCode
169472
Title
Study of central supply methodology for silica-based CMP slurry
Author
Chang, C.N. ; Lien, S.S. ; Hsiao, H.C. ; Tsai, K.T. ; Yu, J.P.
Author_Institution
Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan
fYear
2014
fDate
19-21 May 2014
Firstpage
299
Lastpage
305
Abstract
For supply quality and reliability concern, a Central Dispense System (CDS) for CMP oxide slurry was recently upgraded by replacing a pressure vacuum vessel dispense unit with maglev centrifugal pumps. This opened up the opportunity to measure various slurry health parameters and CMP defect rates before and after the retrofit and thus determine the influence of the slurry dispense method on slurry health and scratch rates. Most slurry health parameters were unaffected by the retrofit. However, a significant reduction in large particle counts could be observed after replacing the pressure vacuum vessel dispense-units with maglev centrifugal pumps. As a result, slightly lower scratch rates were observed after the retrofit.
Keywords
chemical mechanical polishing; slurries; central dispense system; central supply methodology; maglev centrifugal pumps; pressure vacuum vessel dispense unit; silica based CMP slurry; Atmospheric measurements; Bellows; Particle measurements; Pumps; Silicon compounds; Slurries; Valves; CDS; CMP; CU; DEFECTS; DELIVERY SYSTEM; LPC; PRESSURE VESSEL; PUMP; SCRATCHES; SLURRY;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location
Saratoga Springs, NY
Type
conf
DOI
10.1109/ASMC.2014.6847025
Filename
6847025
Link To Document