• DocumentCode
    169472
  • Title

    Study of central supply methodology for silica-based CMP slurry

  • Author

    Chang, C.N. ; Lien, S.S. ; Hsiao, H.C. ; Tsai, K.T. ; Yu, J.P.

  • Author_Institution
    Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan
  • fYear
    2014
  • fDate
    19-21 May 2014
  • Firstpage
    299
  • Lastpage
    305
  • Abstract
    For supply quality and reliability concern, a Central Dispense System (CDS) for CMP oxide slurry was recently upgraded by replacing a pressure vacuum vessel dispense unit with maglev centrifugal pumps. This opened up the opportunity to measure various slurry health parameters and CMP defect rates before and after the retrofit and thus determine the influence of the slurry dispense method on slurry health and scratch rates. Most slurry health parameters were unaffected by the retrofit. However, a significant reduction in large particle counts could be observed after replacing the pressure vacuum vessel dispense-units with maglev centrifugal pumps. As a result, slightly lower scratch rates were observed after the retrofit.
  • Keywords
    chemical mechanical polishing; slurries; central dispense system; central supply methodology; maglev centrifugal pumps; pressure vacuum vessel dispense unit; silica based CMP slurry; Atmospheric measurements; Bellows; Particle measurements; Pumps; Silicon compounds; Slurries; Valves; CDS; CMP; CU; DEFECTS; DELIVERY SYSTEM; LPC; PRESSURE VESSEL; PUMP; SCRATCHES; SLURRY;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
  • Conference_Location
    Saratoga Springs, NY
  • Type

    conf

  • DOI
    10.1109/ASMC.2014.6847025
  • Filename
    6847025