Title :
High density multilayer interconnection concept of HDMI 3D descrambler
Author :
Stanimirovic, Zdravko ; Mrak, Ivanka ; Matic, Vladimir ; Jovanovic, Dragan
Author_Institution :
Telecommun. & Electron. Inst., IRITEL, Belgrade, Yugoslavia
Abstract :
In this paper we would like to introduce HDMI 3D descrambler. It includes three ceramic multichip modules: “PROCESSOR”MCM, “EXTRACTOR”MCM and “ANDESC”MCM. The emphasis is put on the manufacturing process sequences and the results obtained
Keywords :
decoding; integrated circuit interconnections; multichip modules; video signal processing; 3D descrambler; HDMI; ceramic multichip modules; high density multilayer interconnection; manufacturing process sequences; video signal processing; Cable TV; Circuit testing; Dielectric substrates; Integrated circuit interconnections; Multichip modules; Nonhomogeneous media; Packaging; Protection; Satellite broadcasting; Wiring;
Conference_Titel :
Microelectronics, 1995. Proceedings., 1995 20th International Conference on
Conference_Location :
Nis
Print_ISBN :
0-7803-2786-1
DOI :
10.1109/ICMEL.1995.500970
