Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0Ag-0.5Cu alloy

Author

Jeon, Young-Doo ; Nieland, Sabine ; Ostmann, Adreas ; Reichl, Herbert ; Paik, Kyung-Wook

Author_Institution

Dept. of Mat. Sci. & Eng, Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

740

Lastpage

746

Abstract

Even though electroless Ni and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu-Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UBM and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics.

Keywords

ageing; electroless deposition; flip-chip devices; integrated circuit packaging; integrated circuit reliability; nickel; reflow soldering; Ni-Al; Sn-Ag-Cu; Sn-Ag-Cu solder; UBM; electroless plating; electronic packaging applications; growth kinetics; interfacial reactions; intermetallics; morphology; reliability; solder joint; thermodynamics; under bump metallurgy; Aging; Electronics packaging; Gold; Intermetallic; Kinetic theory; Materials science and technology; Nickel alloys; Printing; Soldering; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008180

Filename

1008180