Reliability assessment of flipchip on build up laminate based multi-chip package

Author

Chai, T.C. ; Lee, Charles ; Ma, Y.Y. ; Wong, E.H. ; Zhang, X.W. ; Pinjala, D. ; Murthy, S.S. ; Teo, P.S.

Author_Institution

Inst. of Microelectron., Singapore, Singapore

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

747

Lastpage

752

Abstract

A high performance multi-chip package with ∼1300 I/O have been developed. This prototype package uses a build up (BU) laminate substrate with laser-drilled blind vias to provide the high density interconnections for substrate level integration as well as high I/O routing for the 2nd level interconnection to the PCB. Chip to substrate interconnection is by means of flipchip bonding and BGA solder ball for board attach. This paper describes the initial evaluation of reliability testing for the package with emphasis on microvia interconnection reliability and discusses the failure modes encountered with the multi-chip package.

Keywords

chip-on-board packaging; failure analysis; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; laminates; laser beam machining; microassembling; multichip modules; soldering; BGA solder ball board attach; I/O routing; PCB level interconnection; build up laminate substrate; chip to substrate interconnection; failure modes; flipchip bonding; flipchip on build up laminate based multi-chip package; high density interconnections; laser-drilled blind via; microvia interconnection reliability; multi-chip package; package reliability test; prototype package; reliability assessment; substrate level integration; Bonding; Chemical technology; Consumer electronics; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Laminates; Microelectronics; Routing; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008181

Filename

1008181