• DocumentCode
    1695504
  • Title

    Industry-university partnership in graduate research and education

  • Author

    Srihari, K. ; Sammakia, Bahgat G.

  • Author_Institution
    Syst. Sci. & Ind. Eng., State Univ. of New York, Binghamton, NY, USA
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    768
  • Lastpage
    771
  • Abstract
    Active interaction and collaboration between industry and academia has always assisted engineering education, especially at the graduate level. The mode of interaction varies and occurs at several levels. This paper discusses a novel approach to industry-university partnership that is grounded in a long-term research based relationship. For over a decade, graduate research associates and faculty from the State University of New York have interacted with several industrial partners, working together as a team to address fundamental issues in electronics packaging and manufacturing. Through this effective partnership, over 100 graduate students have completed their master´s thesis and their doctoral dissertations. The University has received research funding that exceeds several million dollars for numerous research endeavors (projects).
  • Keywords
    continuing education; educational courses; electronic engineering education; electronic equipment manufacture; packaging; State University of New York; collaboration; electronics manufacturing; electronics packaging; graduate education; graduate level engineering education; graduate research; graduate research associates; graduate students; industrial partners; industry-university partnership; long-term research based relationship; research funding; Collaboration; Educational products; Electronics industry; Electronics packaging; Employment; Engineering education; Industrial electronics; Industrial relations; Knowledge engineering; Manufacturing industries;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2002. Proceedings. 52nd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7430-4
  • Type

    conf

  • DOI
    10.1109/ECTC.2002.1008186
  • Filename
    1008186