Micropackaging using thin films as mechanical components

Author

Boyle, P. ; Moore, D.F. ; Syms, R.R.A.

Author_Institution

Dept. of Eng., Cambridge Univ., UK

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

801

Lastpage

807

Abstract

The development and testing of simulation software based on variational principles to examine the behavior of structures undergoing large scale elastic deflections is described. The programmes are used in the design of micro mechanical beams for packaging applications, specifically in the domain of passive alignment of optical components. The micromachining/etching fabrication process is described for 5 μm thick silicon carbide beams which are then tested by bending them.

Keywords

etching; mechanical testing; microassembling; micromachining; micropositioning; optical fibre couplers; packaging; semiconductor device models; semiconductor device testing; semiconductor thin films; silicon compounds; variational techniques; wide band gap semiconductors; 5 micron; SiC; beam bend testing; etching; large scale elastic deflection; micro mechanical beams; micromachining; micropackaging; optical component packaging applications; optical component passive alignment; optoelectronics; precision assembly; precision positioning; silicon carbide beam fabrication process; simulation software; structural behaviour analysis; thin film mechanical components; variational principles analysis; Application software; Etching; Large-scale systems; Micromachining; Optical design; Optical device fabrication; Optical devices; Packaging; Software testing; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008191

Filename

1008191