Title :
Micropackaging using thin films as mechanical components
Author :
Boyle, P. ; Moore, D.F. ; Syms, R.R.A.
Author_Institution :
Dept. of Eng., Cambridge Univ., UK
fDate :
6/24/1905 12:00:00 AM
Abstract :
The development and testing of simulation software based on variational principles to examine the behavior of structures undergoing large scale elastic deflections is described. The programmes are used in the design of micro mechanical beams for packaging applications, specifically in the domain of passive alignment of optical components. The micromachining/etching fabrication process is described for 5 μm thick silicon carbide beams which are then tested by bending them.
Keywords :
etching; mechanical testing; microassembling; micromachining; micropositioning; optical fibre couplers; packaging; semiconductor device models; semiconductor device testing; semiconductor thin films; silicon compounds; variational techniques; wide band gap semiconductors; 5 micron; SiC; beam bend testing; etching; large scale elastic deflection; micro mechanical beams; micromachining; micropackaging; optical component packaging applications; optical component passive alignment; optoelectronics; precision assembly; precision positioning; silicon carbide beam fabrication process; simulation software; structural behaviour analysis; thin film mechanical components; variational principles analysis; Application software; Etching; Large-scale systems; Micromachining; Optical design; Optical device fabrication; Optical devices; Packaging; Software testing; Transistors;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008191
