DocumentCode :
1696221
Title :
An IDDQ based built-in concurrent test technique for interconnects in a boundary scan environment
Author :
Su, Chauchin ; Hwang, Kychin ; Jou, Shyh-Jye
Author_Institution :
Dept. of Electr. Eng., Nat. Central Univ., Chung-Li, Taiwan
fYear :
34608
Firstpage :
670
Lastpage :
676
Abstract :
An IDDQ based scheme has been presented for concurrent built-in self-test of MCM interconnects. The scheme detects interconnect faults while the system is on-line
Keywords :
boundary scan testing; built-in self test; electric current measurement; fault diagnosis; integrated circuit interconnections; logic testing; multichip modules; IDDQ built-in concurrent test; MCM interconnects; boundary scan environment; detection latency analysis; fault detection; interconnect faults; online; stuck-at fault; Automatic testing; Built-in self-test; Circuit testing; Connectors; Fixtures; Integrated circuit interconnections; Packaging; Pins; Registers; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 1994. Proceedings., International
Conference_Location :
Washington, DC
ISSN :
1089-3539
Print_ISBN :
0-7803-2103-0
Type :
conf
DOI :
10.1109/TEST.1994.528012
Filename :
528012
Link To Document :
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