• DocumentCode
    1696367
  • Title

    A Success Factor of a Digital Material Startup Company

  • Author

    Hayashida, Hideki

  • Author_Institution
    Osaka Univ., Suita
  • fYear
    2007
  • Firstpage
    1322
  • Lastpage
    1322
  • Abstract
    Summary form only given. Japanese part/materials industry has high technology and competitive power globally and offers a part/materials having high reliability and performance to an end product such as digital home electronics. In a field of the digital material which is used for an information digital home electronics and a semiconductor in that, there is a Japanese maker holding more than 50% of world share. It is expected that strengthening of the chemistry and the new material industry that became basic was indispensable for a further competitive edge strengthening of such industry, and the role of a research and development type start-up companies that especially bore the innovation of the new material and the new functional feature was large, but a yet enough study has not been done. By this lecture, I report the thing that is different from a conventional research and development model aiming at industrialization of core technology from analysis of a case study of a startup material company which supplies for an information digital home electronics or a semiconductor and argue for the success factor.
  • Keywords
    domestic appliances; integrated circuit manufacture; research and development; digital home electronics; digital material startup companies; research and development; semiconductor industry; Boring; Chemistry; Electronics industry; Industrial electronics; Information analysis; Materials reliability; Research and development; Semiconductor materials; Technological innovation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management of Engineering and Technology, Portland International Center for
  • Conference_Location
    Portland, OR
  • Print_ISBN
    978-1-8908-4315-1
  • Electronic_ISBN
    978-1-8908-4315-1
  • Type

    conf

  • DOI
    10.1109/PICMET.2007.4349454
  • Filename
    4349454