Silicon electroosmotic micropumps for integrated circuit thermal management

Author

Laser, D.J. ; Myers, A.M. ; Shuhuai Yao ; Bell, K.F. ; Goodson, K.E. ; Santiago, J.G. ; Kenny, T.W.

Author_Institution

Dept. of Mech. Eng., Stanford Univ., CA, USA

Volume

1

fYear

2003

Firstpage

151

Abstract

We are developing a class of electroosmotic micropumps fabricated from silicon substrates that can be used for integrated circuit thermal management applications. Prototype micropumps with 0.15 cm/sup 3/ packages produce a maximum flow rate of 170 /spl mu/L min/sup -1/ and a maximum pressure of 10 kPa operating at 400 V. These specifications approach the requirements for single-phase forced-convective cooling of small IC hot spots. The micropumps operate on less than 200 mW and, having no moving structural elements, offer inherent reliability advantages. The impact on pump performance of geometry, surface treatment, and choice of working fluid has been characterized.

Keywords

elemental semiconductors; integrated circuit packaging; microfluidics; micropumps; monolithic integrated circuits; reliability; semiconductor device models; silicon; thermal management (packaging); 10 kPa; 200 mW; 400 V; IC hot spots; Si; flow rate; integrated circuit thermal management; prototype micropumps; reliability; silicon electroosmotic micropumps fabrication; silicon substrates; single-phase forced-convective cooling; surface treatment; working fluid; Application specific integrated circuits; Cooling; Geometry; Integrated circuit packaging; Micropumps; Prototypes; Pumps; Silicon; Surface treatment; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-7731-1

Type

conf

DOI

10.1109/SENSOR.2003.1215275

Filename

1215275