Isothermal low cycle fatigue tests of Sn/3.5Ag/0.75Cu and 63Sn/37Pb solder joints under mixed-mode loading cases

Author

Park, Tae-Sang ; Lee, Soon-Bok

Author_Institution

Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

979

Lastpage

984

Abstract

To give a proper and accurate estimation of the fatigue life of solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. The loading phase is controlled by the angle of loading direction. Experiments are conducted with 63Sn/37Pb and Sn/3.5Ag/0.75Cu solder joints. The isothermal mechanical low cycle fatigue tests were performed under several loading phases. Constant displacement controlled tests are performed using a micromechanical test apparatus. Failure patterns of the fatigue tests are observed and discussed. Morrow energy model was examined and found to be a proper low cycle fatigue model for solder joints.

Keywords

copper alloys; fatigue testing; lead alloys; silver alloys; soldering; tin alloys; Morrow energy model; Sn-Ag-Cu; Sn-Pb; failure pattern; fatigue life; isothermal mechanical low-cycle fatigue test; micromechanical test apparatus; mixed-mode loading; solder joint; Capacitive sensors; Electronic packaging thermal management; Electronics packaging; Fatigue; Isothermal processes; Performance evaluation; Soldering; System testing; Tensile stress; Thermal expansion;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008220

Filename

1008220