Title :
A novel wire bonded plastic chip scale package for RF and microwave applications
Author :
Yeo, Yong-Kee ; Khan, Navas ; Iyer, Mahadevan K.
Author_Institution :
Inst. of Microelectron., Singapore, Singapore
fDate :
6/24/1905 12:00:00 AM
Abstract :
A plastic wire bonded Chip Scale Package (CSP) has been designed, fabricated and characterised for RF and high-speed digital applications. Novel ground plane design and optimised interconnect structures resulted in good RF performance up to 5.5 GHz and the package is also expected to support digital pulses with 1.5 GHz clock frequency without signal integrity problems. Due to concurrent RF and thermal design, the heat dissipation capability of the package is not compromised while the electrical performance is being optimised. The detailed design, modelling and measurement methodologies are described in this paper.
Keywords :
MMIC; S-parameters; UHF integrated circuits; chip scale packaging; digital integrated circuits; equivalent circuits; high-speed integrated circuits; lead bonding; modelling; thermal analysis; thermal management (packaging); thermal resistance; 1.5 GHz; 5.5 GHz; RF applications; concurrent RF/thermal design; equivalent circuit modeling; ground plane design; heat dissipation capability; high-speed digital applications; microwave applications; optimised interconnect structures; plastic chip scale package; signal integrity; wire bonded plastic CSP; Bonding; Chip scale packaging; Clocks; Design optimization; Electromagnetic heating; Ground support; Plastic packaging; Radio frequency; Signal design; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008230
