Author :
Zhang, Leilei ; Chee, Soon-Shin ; Maheshwari, Abhay
Author_Institution :
Xilinx Inc., San Jose, CA, USA
fDate :
6/24/1905 12:00:00 AM
Abstract :
Innovative MPM (multi package module) BGA (ball grid array) packages have been developed at Xilinx to satisfy the needs for space-efficient, pre-engineered, high-density system-level multiple IC solution. MPM BGA package takes advantage of the miniaturization trends in electronic packaging industry, avoiding known good die (KGD) testing/handling issues and improves the system performance by bridging the gap between current packaging technology and advanced IC technology. This paper focuses on MPM BGA package structure, assembly flow, package performance and one example of the application.
Keywords :
assembling; ball grid arrays; integrated circuit packaging; integrated circuit reliability; BGA; IC application; MPM; Xilinx; assembly flow; high-density system level solution; multi package module; multiple IC solution; package performance; package structure; Assembly; Bonding; Costs; Electronic components; Electronic equipment testing; Electronics packaging; Flip chip; Integrated circuit packaging; Space technology; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008242
