Title :
1997 IEEE International Conference on Microelectronic Test Structures Proceedings
Abstract :
The following topics were covered: process characterisation; linewidth and overlay; bipolar and high frequency test structures; reliability; interconnects and capacitance; dielectric characterisation; parameter extraction and matching; sensors and micromaching
Keywords :
capacitance measurement; dielectric thin films; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; micromachining; monolithic integrated circuits; sensors; HF test structures; bipolar test structures; capacitance; dielectric characterisation; interconnects; linewidth; microelectronic test structures; micromaching; overlay; parameter extraction; parameter matching; process characterisation; reliability; sensors;
Conference_Titel :
Microelectronic Test Structures, 1997. ICMTS 1997. Proceedings. IEEE International Conference on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-3243-1
DOI :
10.1109/ICMTS.1997.589279
