• DocumentCode
    1697657
  • Title

    UbBM (under bump metallization) study for Pb-free electroplating bumping : interface reaction and electromigration

  • Author

    Jang, Se-Young ; Wolf, Juergen ; Kwon, Woon-Seong ; Paik, Kyung-Wook

  • Author_Institution
    Korea Advanced Institute of Science and Technology
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    1213
  • Lastpage
    1220
  • Keywords
    Aging; Chromium; Current density; Metallization; Morphology; Shape; Solid state circuits; Temperature; Testing; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2002. Proceedings. 52nd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7430-4
  • Type

    conf

  • DOI
    10.1109/ECTC.2002.1008261
  • Filename
    1008261
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1697657