Title :
UbBM (under bump metallization) study for Pb-free electroplating bumping : interface reaction and electromigration
Author :
Jang, Se-Young ; Wolf, Juergen ; Kwon, Woon-Seong ; Paik, Kyung-Wook
Author_Institution :
Korea Advanced Institute of Science and Technology
fDate :
6/24/1905 12:00:00 AM
Keywords :
Aging; Chromium; Current density; Metallization; Morphology; Shape; Solid state circuits; Temperature; Testing; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008261
