Title :
Modeling methodology for predicting the thermo-mechanical reliability of electronic packaging
Author :
Thurston, M. ; Raiser, G. ; Chiang, D. ; Tandon, S. ; Mello, M.
Author_Institution :
Intel Corp., Chandler, AZ, USA
fDate :
6/24/1905 12:00:00 AM
Abstract :
A methodology for predicting the thermo-mechanical reliability of electronic packaging as a function of package design, material, and assembly process variables and environmental conditions is described. The methodology integrates finite element stress and strength analysis, experimental material constitutive and strength property measurement, experimental package stress and strength validation, and statistical design of experiment (DOE) and Monte Carlo analysis techniques. The results of extensive experimental and numerical evaluations demonstrating the stability and capability of the experimental and modeling techniques constituting the methodology are presented.
Keywords :
Monte Carlo methods; finite element analysis; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; semiconductor device models; semiconductor device packaging; semiconductor device reliability; stress analysis; DOE techniques; Monte Carlo analysis techniques; electronic package design; electronic package materials; electronic packaging; finite element strength analysis; finite element stress analysis; material constitutive measurement; material strength property measurement; package assembly process variables; package environmental conditions; package modeling techniques; package strength validation; package stress validation; statistical design of experiment techniques; thermo-mechanical reliability prediction methodology; Assembly; Electronic packaging thermal management; Electronics packaging; Finite element methods; Materials reliability; Predictive models; Stress measurement; Thermal stresses; Thermomechanical processes; US Department of Energy;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008271