Title :
Elevated temperature tensile/creep test of UV-LIGA nickel thin film for design of high-density micro connector
Author :
Isono, Y. ; Tada, J. ; Watanabe, Toshio ; Unno, T. ; Toriyama, T. ; Sugiyama, S.
Author_Institution :
Dept. of Mech. Eng., Ritsumeikan Univ., Shiga, Japan
Abstract :
This paper describes mechanical properties of UV-LIGA Ni films at elevated temperatures for design of a high-density micro connector. A compact tensile tester operated under a scanning probe microscope (SPM) was newly developed, and it characterized a stress-strain relation and creep behavior of the Ni films at temperatures ranging from 300 K to 573 K. 600 /spl mu/m-long, 15 /spl mu/m-thick and 50 /spl mu/m-wide Ni specimens were fabricated by UV-LIGA process with a thick photoresist. This research proposed an inelastic constitutive equation of UV-LIGA Ni films for an optimum design of micro connector by finite element analyses.
Keywords :
LIGA; creep testing; finite element analysis; metallic thin films; micromechanical devices; nickel; scanning probe microscopy; stress-strain relations; tensile testing; ultraviolet radiation effects; 15 micron; 300 to 573 K; 50 micron; 600 micron; Ni; Ni films; SPM; UV-LIGA nickel thin film; creep test; finite element analyses; high density micro connector; inelastic constitutive equation; mechanical properties; photoresist; scanning probe microscopy; stress-strain relation; tensile test; Connectors; Creep; Equations; Mechanical factors; Nickel; Resists; Scanning probe microscopy; Temperature distribution; Testing; Transistors;
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
DOI :
10.1109/SENSOR.2003.1215352
