A test chip and step-by-step procedure for MEMS material property determination using micromachined structures

Author

Chi Hsiang Pan

Author_Institution

Dept. of Mech. Eng., Nat. Chin-Yi Inst. of Technol, Tainan, Taiwan

Volume

1

fYear

2003

Firstpage

460

Abstract

We present a test chip and step-by-step procedure for MEMS material property determination, including residual stress (RS), Young´s modulus (YM), thermal expansion coefficient (TEC), temperature resistivity coefficient (TRC), and thermal conductive coefficient (TCC). The test chip consists of one basic micromachined test structure and can be extended to a broader class of test structures. The required experimental apparatus are an optical microscope along with a heating stage, probe stages, and a power supply. Analytical models are derived for the task of extracting the properties. Experimental results with phosphorous-doped LPCVD poly crystalline silicon films are used to demonstrate the effectiveness of the proposed method.

Keywords

CVD coatings; Young´s modulus; elemental semiconductors; heat treatment; internal stresses; micromechanical devices; optical microscopy; phosphorus; semiconductor thin films; silicon; thermal conductivity; thermal expansion; LPCVD; MEMS material property; Si:P; Youngs modulus; analytical models; chip; heating; micromachined structures; optical microscopy; phosphorous-doped poly crystalline silicon films; residual stress; temperature resistivity coefficient; thermal conductive coefficient; thermal expansion coefficient; Material properties; Materials testing; Micromechanical devices; Optical films; Optical microscopy; Residual stresses; Thermal conductivity; Thermal expansion; Thermal resistance; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-7731-1

Type

conf

DOI

10.1109/SENSOR.2003.1215353

Filename

1215353