DocumentCode :
1698607
Title :
T-jet: a novel thermal inkjet printhead with monolithically fabricated nozzle plate on SOI wafer
Author :
Baek, S.S. ; Lim, H.T. ; Song, H. ; Kim, Y.S. ; Bae, K.D. ; Cho, C.H. ; Lee, C.S. ; Shin, J.W. ; Shin, S.J. ; Kuk, K. ; Oh, Y.S.
Author_Institution :
Samsung Adv. Inst. of Technol., Seoul, South Korea
Volume :
1
fYear :
2003
Firstpage :
472
Abstract :
A novel thermal inkjet printhead with monolithically fabricated nickel nozzle plate on SOI wafer has been proposed for the first time. A chamber and a restrictor are implemented on the 40 /spl mu/m thick top-silicon layer, and a nozzle plate covering heater layers are monolithically fabricated on them. Unlike the general back-shooters, the inkjet printhead reported here is a kind of back-shooter, which has a chamber and a restrictor with arbitrary shape by utilizing the silicon dioxide etch-stop layers in the bottom and sidewalls of chamber. Moreover, nozzle plating mold process, followed by placing the chamber underneath the heater layer, is performed on a planar surface, resulting in more uniform and reliable control of nozzle size. The new design was applied for monochrome inkjet printhead, which has 56 nozzles in 2 columns with real 600NPI(nozzle per inch), and showed good performances such as a drop velocity of 12 m/s, a drop volume of 30 pl, and a maximum firing frequency of 12 kHz for single nozzle ejection. From nozzle by nozzle inspection, we observed the uniformity variation of less than 4% in drop speed as well as drop volume. The monolithic fabrication process resulted in a good uniformity and is expected to have superior manufacturing yield to the nozzle assembly process.
Keywords :
drops; etching; inspection; jets; moulding; nickel; nozzles; 12 kHz; 40 micron; Ni; SOI wafer; Si; back-shooters; drop; monolithically fabricated nickel nozzle plate; nozzle ejection; nozzle inspection; nozzle plating mold process; silicon dioxide etch-stop layers; thermal inkjet printhead; Etching; Fabrication; Frequency; Inspection; Manufacturing processes; Nickel; Shape; Silicon compounds; Size control; Temperature control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
Type :
conf
DOI :
10.1109/SENSOR.2003.1215356
Filename :
1215356
Link To Document :
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