Title :
Alternative bumping processes for DRAM-CSP
Author :
Biedorf, Rolf ; Heinze, Roland ; Wollanke, Alexander ; Wolter, Klaus ; Zerna, Thomas ; Plötzke, Andreas
Author_Institution :
Electron. Technol. Lab., Dresden Univ. of Technol., Germany
fDate :
6/24/1905 12:00:00 AM
Abstract :
The usual assembly of CSP on printed circuit boards requires a relatively high volume of solder paste in a very small pitch. That´s why a multiple step process is used with bumping of the interposer using pre-formed solder balls, with screen printing of solder paste on the substrate and with an reflow soldering step. In this paper three variants of bumping of CSP are discussed and some results of optimising the bumping and the assembly process of CSP are presented.
Keywords :
assembling; circuit optimisation; printed circuit manufacture; printing; reflow soldering; surface mount technology; DRAM-CSP; assembly; bumping optimisation; bumping processes; interposer; multiple step process; pitch; pre-formed solder balls; printed circuit boards; reflow soldering step; screen printing; solder paste; Apertures; Assembly; Bonding; Electronic components; Laboratories; Manufacturing; Printed circuits; Printing; Productivity; Reflow soldering;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008299
