Electronics packaging - a Web-based course for the IEEE community

Author

Caggiano, Michael F. ; Ho, Ka M.

Author_Institution

Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

1510

Lastpage

1516

Abstract

The authors profile a course that is a Web-based enhancement of a new graduate. course entitled "Electronics Packaging" that was developed and introduced into the ECE Department at Rutgers University during the spring of 2001. This new course deals with the electrical characterization and modeling of the parasitics for integrated circuit packaging. The course is targeted to the electrical engineering graduate population of full-time students and industry part-time graduate students that have a background in circuit analysis. The authors discuss the status of the course and demonstrate a sample of the Web designed lectures related to the electrical parasitics of the package.

Keywords

Internet; computer aided instruction; educational courses; electronic engineering computing; electronic engineering education; integrated circuit packaging; IC packaging course; IEEE Community; Rutgers University; Web-based course; electrical characterization; electrical engineering graduates; electronics packaging course; graduate course; integrated circuit packaging; microelectronic packaging; parasitics modeling; Capacitance; Circuit synthesis; Costs; Electronic packaging thermal management; Electronics packaging; Inductance; Integrated circuit modeling; Integrated circuit packaging; Springs; Very high speed integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008307

Filename

1008307