DocumentCode :
1698846
Title :
Hands-on module packaging education at Georgia Tech
Author :
Doraiswami, Ravi ; Li, Jing ; Bhattacharya, Swapan K. ; Conrad, Leyla ; May, Gary S. ; Tummala, Rao R.
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
1517
Lastpage :
1523
Abstract :
The Design Build and Operate (DBO) course at PRC (the Packaging Research Center at Georgia Institute of Technology) provides hands-on experience in SOP (System on a Package) packaging for undergraduate and graduate students. DBO consists of a sequence of two courses: Design Build Operate I (DBO I), which focuses on substrate fabrication and Design Build Operate II (DBO II), which focuses on module assembly. This paper presents an overview of the second component of the sequence, the DBO II (module) course. A detailed presentation of the experiments conducted and their results are presented. A user friendly software which helps students to conduct virtual designs and fabrication processes is also presented.
Keywords :
educational courses; electronic engineering education; integrated circuit packaging; modules; product development; Design Build Operate course; Georgia Institute of Technology; graduate students; hands-on module packaging education; microelectronic systems packaging; module assembly; product development cycle emulation; system on package; undergraduate students; user friendly software; virtual designs; virtual fabrication processes; Assembly; Automatic testing; Costs; Flip chip; Microelectronics; Partial response channels; Radio frequency; Semiconductor device packaging; Surface-mount technology; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN :
0569-5503
Print_ISBN :
0-7803-7430-4
Type :
conf
DOI :
10.1109/ECTC.2002.1008308
Filename :
1008308
Link To Document :
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